AG Series Semiconductor Packaging 3D tester

The Choice for High-Precision Measurement in Semiconductor Packaging

• Professional High-Definition Imaging for High-Reflective Surfaces

  Equipped with a high-resolution lens specially designed for high magnification, it supports AO/ YO to achieve dynamic high magnification (field of view range: 0.14×–27.5×; working distance:20–45mm).The lens can effectively eliminate chromatic aberration and image distortion, producing ultra-high-quality images. It is also built with a coaxial lighting system, fully adapting to high-precision inspection of high-reflective surfaces.
• Intelligent Auto-Focus: High-Definition Imaging Even for Small Scenes

  Equipped with the ISOBIT auto-focus system, which adopts laser triangulation technology to achieve high-precision and high-speed auto-focus.It effectively solves the problem of blurred imaging caused by small laser spots when detecting targets of 1μm and below, ensuring the clarity of sample imaging.
• User-Friendly Software & Seamless Data Connectivity

  The software is simple and easy to use; after short-term training, users can complete data measurement of dimensions, angles, geometric tolerances, etc.It supports batch data export to Excel reports, SPC statistical data analysis, and custom report formats, and seamlessly connects to the MES system.It can integrate multiple measurement sensors to realize compound measurement.