COBEKK - BGA Chip Height Measurement - Semiconductor Metrology

Customer Demand

Inspect and provide the flatness of the measured points, the height values of the 9 points, and the height difference (HMAX-MIN).

Product physical image

Measuring Result

Test results

Specific product inspection requirements

Ⅰ.Image effect

Ⅱ.Measurement process video

NOTE:Videos shows the method of site reconnaissance as the focusing method, as well as the real-time images of the site reconnaissance areas.

1 . Sample 1 measurement video

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2 . Sample 2 measurement video

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3 . Sample 3 measurement video

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Ⅲ.Measured data

Note：The measurement data is 5 times and the output mode is horizontal output

1 . Sample 1 measurement data

2 . Sample 2 measurement data

3 . Sample 3 measurement data

Test Conclusion

COBEKK recommends using the products of the AG series for measuring BGA chips.

INDUSTRY SOLUTIONS